
Researches By Tsmu
SK Hynix and TSMC have signed a strategic partnership to develop next-generation HBM4 memory, crucial for AI and high-performance computing. This collaboration combines SK Hynix’s expertise in memory chips with TSMC’s advanced packaging technology (CoWoS) to deliver industry-leading AI solutions. By working together, the two companies aim to strengthen their market leadership and accelerate innovation in the semiconductor industry.
SK Hynix & TSMC: The HBM4 Collaboration Explained
12 February, 2025 | GraniteShares
SK Hynix and TSMC have signed a strategic partnership to develop next-generation HBM4 memory, crucial for AI and high-performance computing. This collaboration combines SK Hynix’s expertise in memory chips with TSMC’s advanced packaging technology (CoWoS) to deliver industry-leading AI solutions. By working together, the two companies aim to strengthen their market leadership and accelerate innovation in the semiconductor industry.
GraniteShares – Fund Distributions – December 2024
Topic: Technology , Leveraged Single Stocks , YieldBOOST
Publication Type: Market Commentaries
GraniteShares – Fund Distributions – December 2024
27 December, 2024 | GraniteShares
GraniteShares – Fund Distributions – December 2024